RO4350B 6-Layer 1.6mm PCB with ENIG & Blind Vias for RF/Microwave Applications
1.Introduction of RO4350B
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics that offer electrical performance close to PTFE/woven glass along with the manufacturability of epoxy/glass. These laminates provide tight control over dielectric constant (Dk) and maintain low loss characteristics, while being processed using standard epoxy/glass methods. RO4350B materials are available at a fraction of the cost of conventional microwave laminates and do not require special through-hole treatments or handling procedures like PTFE-based materials. They are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs. The thermal expansion coefficient (CTE) of RO4350B is similar to that of copper, ensuring excellent dimensional stability—a critical property for mixed dielectric multi-layer boards. The low Z-axis CTE guarantees reliable plated through-hole quality even under severe thermal shock conditions. With a Tg exceeding 280°C, RO4350B maintains stable expansion properties across all circuit processing temperatures.
2.Key Features
Dielectric Constant: 3.48 ±0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Conductivity: 0.69 W/m/°K
CTE: X: 10 ppm/°C, Y: 12 ppm/°C, Z: 32 ppm/°C
High Tg: >280°C
Low Water Absorption: 0.06%
UL 94 V-0 Rated
3.Benefits
Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication cost
Excellent dimensional stability
Competitively priced
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO4350B |
| Layer Count | 6-layer |
| Board Dimensions | 110mm x 80mm (±0.15mm) |
| Min. Trace/Space | 4/4 mils |
| Min. Hole Size | 0.3mm |
| Blind Vias | L1-L4, L5-L6 |
| Finished Thickness | 1.6mm |
| Cu Weight (Inner/Outer) | 1oz (35μm) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top/Bottom Silkscreen | White |
| Top/Bottom Solder Mask | Green |
| Electrical Test | 100% |
5.PCB Stackup (6-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.254 mm (10mil)
Copper_layer_2 - 35 μm
Prepreg RO4450F X 2 - 0.2mm
Copper_layer_3 - 35 μm
Rogers RO4350B Core - 0.508 mm (20mil)
Copper_layer_4 - 35 μm
Prepreg RO4450F X 2 - 0.2mm
Copper_layer_5 - 35 μm
Rogers RO4350B Core - 0.254 mm (10mil)
Copper_layer_6 - 35 μm
6.PCB Statistics:
Components: 28
Total Pads: 120
Thru Hole Pads: 96
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 455
Nets: 12
7.Typical Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
